[韩国] HS编码8466300100
编码描述：,chips, dice and wafers not yet cut into chips,diodes, other than photosensitive or light emitting diodes 编码来源：韩国原始海关数据 产品标签： butyl acrylate,acrylic acid,dice,photo,diode,ester,sensi,chips,wafers,light emitting diode
最新的交易
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交易日期 2009/10/01
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供应商 ---采购商 korea hosiden electronics co.ltd.
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出口港 ---进口港 ---
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供应区 ---采购区 South Korea
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重量 ---金额 ---
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HS编码 8466300100产品标签 dice chips diode photo sensi wafers light emitting diode
- 产品描述 ,chips, dice and wafers not yet cut into chips,diodes, other than photosensitive or light emitting diodes